It was recently announced that after a design win in Apple's iPhone 6 Plus, NXP Semiconductor NV (Eindhoven, the Netherlands) has announced that its near field communications (NFC) chips are going to be used across the breadth of Qualcomm's Snapdragon-based platforms. Key points of the announcement include:
- NXP describes the arrangement with Qualcomm Technologies Inc. as a collaboration that will accelerate the adoption of NFC and security not only in mobile devices such as smartphones and tablet computers, but also in wearable equipment and Internet of Things (IoT) devices.
- Qualcomm plans to include NXP's NFC and embedded secure element (eSE) technology across platforms based on Snapdragon 800, 600, 400 and 200 processors, NXP says in a statement. In particular, reference designs are expected to expand the use of NFC in home automation, automotive, smart appliances and wearables, NXP says.
- In the case of the Qualcomm collaboration, the reference designs will feature NXP’s NQ220 module which was derived from the PN66T module that launched in November 2014. The PN66T includes the P61 secure microcontroller, and a “loader services” to simplify the deployment of credentials to devices.
- Rafael Sotamayor, senior vice president at NXP Semiconductors also states that "We continue to see the market use and acceptance of NFC grow daily, with new applications being created at an astounding rate. By working together, each company is able better to focus on its respective area of expertise, ensuring the industry receives a best-in-class, robust, tested and certified solution that can be designed in quickly by OEMs with minimal effort."
The deal means that Qualcomm is dropping its in-house.....